Seeking an Embedded Systems Engineer to contribute to the development of stable, maintainable, and flexible firmware systems. Should you meet the requirements for this position, please email your CV ...
In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, ...
Abstract: This paper describes mounting of standard surface mount component packages on a paper substrate using an industrial solder process with a low-temperature solder. The use of paper as a ...
TDK has created a range of surface-mount high-current common-mode chokes. “Customers who prefer reflow soldering but need high-current common-mode chokes can now get an SMD solution,” according to the ...
IWATA, January 18, 2024 - Yamaha Motor Co., Ltd. (Tokyo:7272) announced today that on March 1ˢᵗ, 2024, the Company will add the high-end specification YRi-V TypeHS to the YRi-V 3D hybrid automated ...
The VP-01G-Y combines high-speed and high-resolution inspection in one device, employing sophisticated algorithms in both 2D and 3D modes for improved focusing and contour extraction. Its analysis ...
Apple's Unified Memory Architecture first brought changes to the Mac with Apple Silicon M1 chips. There are clear architectural benefits for the hardware — and it is both good and bad for consumers.
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