Piper Plastics (Chandler, AZ) reports that it has developed a proprietary high-pressure molding technology that yields near-net-shape polymers up to 2 inches thick without porosity, voids or sinks.
Dow (NYSE: Dow) will preview its latest silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021 in Booth #I2616. These next-generation silicone-organic hybrid adhesives, ...
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